1/5 STPS140Z ? january 2002 - ed: 1b power schottky rectifier i f 1a v rrm 40 v v f (max) 0.49 v tj (max) 150c main product characteristics n very small conduction losses n negligible switching losses n extremely fast switching features and benefits single schottky rectifier suited for switchmode power supplies and high frequency dc to dc con- verters. packaged in sod-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. due to the small size of the package this device fit gsm and pcmcia requirements. description sod-123 symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f continuous forward current t amb =60c 1 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 5.5 a i rrm repetitive peak reverse current tp = 2 m s square f = 1khz 0.5 a i rsm non repetitive peak reverse current tp = 100 m s square 1 a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 t l maximum temperature for soldering during 10s 260 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink
STPS140Z 2/5 symbol parameter value unit r th (j-a) junction to ambient * 175 c/w * with 50 mm 2 copper area (e=35 m m) thermal resistances symbol tests conditions tests conditions min. typ. max. unit i r * reverse leakage current tj = 25c v r =5v 10 m a tj=25 cv r = 40v 40 m a tj = 100c 1.5 5 ma v f ** forward voltage drop tj = 25 ci f = 1 a 0.55 v tj = 100c 0.45 0.51 static electrical characteristics pulse test : * t p=5ms, d <2% ** tp = 380 m s, d <2% to evaluate the maximum conduction losses use the following equation : p=0.2xi f(av) +0.3xi f 2 (rms) at tj = 150c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 pf(av)(w) t d =tp/t tp d = 1 d = 0.5 d = 0.2 d = 0.1 d = 0.05 if(av) (a) fig. 1: average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 tamb(c) if(av)(a) t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d =1).
STPS140Z 3/5 1e-3 1e-2 1e-1 1e+0 0 1 2 3 4 5 t(s) im(a) ta=25c ta=60c i m t d =0.5 fig. 3: non repetive surge peak forward current versus overload duration (maximum values). 1e-2 1e-1 1e+0 1e+1 5e+1 1e-2 1e-1 1e+0 tp(s) zth(j-a)/rth(j-a) t d =tp/t tp single pulse d = 0.1 d = 0.2 d = 0.5 fig. 4: relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board fr4 with recommended pad layout). 0 5 10 15 20 25 30 35 40 1e-4 1e-3 1e-2 1e-1 1e+0 1e+1 5e+1 vr(v) ir(ma) tj=70c tj=25c tj=100c tj=150c fig. 5: reverse leakage current versus reverse voltage applied (typical value). 0 25 50 75 100 125 150 1e-1 1e+0 1e+1 1e+2 1e+3 5e+3 tj(c) ir[tj] / ir[tj=25c] vr=40v fig. 6: reverse leakage current versus junction temperature (typical value). 12 51020 50 10 20 50 100 200 vr(v) c(pf) f=1mhz tj=25c fig. 7: junction capacitance versus reverse voltage applied (typical value). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1e-2 1e-1 1e+0 5e+0 vfm(v) ifm(a) tj=100c tj=25c tj=150c fig. 8-1: forward voltage drop versus forward current (high level, maximum values).
STPS140Z 4/5 0 102030405060708090100 100 120 140 160 180 200 220 240 260 280 300 s(cu) (mm2) rth(j-a) (c/w) if=1a fig. 9: thermal resistance junction to ambient versus copper surface (epoxy printed circuit board fr4, copper thickness: 35 m m). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 vfm(v) ifm(a) tj=100c tj=25c tj=150c fig. 8-2: forward voltage drop versus forward current (low level, maximum values).
STPS140Z 5/5 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com package mechanical data sod-123 plastic h b d e a1 a2 a g c ref. dimensions millimeters inches min. max. min. max. a 1.45 0.057 a1 0 0.1 0 0.004 a2 0.85 1.35 0.033 0.053 b 0.55 typ. 0.022 typ. c 0.15 typ. 0.039 typ. d 2.55 2.85 0.1 0.112 e 1.4 1.7 0.055 0.067 g 0.25 0.01 h 3.55 3.95 0.14 0.156 type marking package weight base qty delivery mode STPS140Z z54 sod-123 0.01 g 3000 tape & reel n epoxy meets ul94, v0 n band indicates cathode marking 4.45 0.65 0.97 2.51 0.97 footprint (in millimeters)
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